Seoul, September 12, 2025 – SK hynix Inc. introduced it has accomplished improvement and completed preparation of a next-generation high-bandwidth reminiscence product HBM4.
The corporate stated HBM4 vertically interconnects a number of DRAM chips and will increase information processing pace compared to typical DRAM merchandise. There are six generations of HBM, beginning with the unique HBM which was adopted by HBM2, HBM2E, HBM3, HBM3E, and HBM4.
SK hynix stated that the corporate has efficiently accomplished improvement and has ready HBM4 mass manufacturing to steer the AI period. By this momentum, the corporate has as soon as once more confirmed the AI reminiscence management within the world market.
“Completion of HBM4 improvement can be a brand new milestone for the business,” Joohwan Cho, Head of HBM Improvement at SK hynix, who has led the event, stated. “By supplying the product that meets buyer wants in efficiency, energy effectivity and reliability in well timed method, the corporate will fulfill time to market and keep aggressive place.”
With current improve in AI demand and information processing, the wants for prime bandwidth reminiscence for quicker system pace are surging. As well as, securing reminiscence energy effectivity has emerged as a key requirement for patrons as energy consumption for information heart operation has elevated. SK hynix expects HBM4, with elevated bandwidth and energy effectivity, to be the optimum resolution to satisfy prospects’ wants.
HBM4, of which mass manufacturing system has been readied, has the business’s greatest information processing pace and energy effectivity with the bandwidth doubled by means of adoption of two,048 I/O terminals, double from the earlier technology, and energy effectivity improved by greater than 40 %. The corporate expects to enhance AI service efficiency by as much as 69% when the product is utilized, which can result in clear up information bottleneck and considerably cut back information heart energy prices.
The corporate has exceeded the JEDEC (Joint Electron Gadget Engineering Council)normal working pace(8Gbps) by implementing over 10Gbps(Gigabit per second) working pace in HBM4.
As well as, the corporate adopted the Superior MR-MUF (Mass Reflow Molded Underfill) course of in HBM4, which has been confirmed to be dependable out there, and the 1bnm course of, or the fifth-generation of the 10-nanometer expertise, to attenuate the danger in mass manufacturing.
“We’re unveiling the institution of the world’s first mass manufacturing system of HBM4,” Justin Kim, President & Head of AI Infra at SK hynix, stated. “HBM4, a symbolic turning level past the AI infrastructure limitations, can be a core product for overcoming technological challenges.” “We are going to develop right into a full-stack AI reminiscence supplier by supplying reminiscence merchandise with the very best quality and numerous efficiency required for the AI period in a well timed method.”
